Mid Sweden University

Compositional variations of sputter deposited Ti/W barrier layers on substrates with pronounced surface topography 1999 (English)In: Thin Solid Films, ISSN 0040-6090, E-ISSN 1879-2731, Vol. 348, no 1-2, p. 227-232Article in journal (Refereed) Published

Abstract [en]

Sputter deposited Ti/W barrier layers have been found to be Ti deficient with respect to the target composition, which is attributed to the preferential resputtering of Ti from the deposited films by energetic neutrals or ions from the discharge. On the o

Place, publisher, year, edition, pages

1999. Vol. 348, no 1-2, p. 227-232

Keywords [en]

deposition process; titanium; tungsten; ion bombardment; YIELD AMPLIFICATION; ION-BOMBARDMENT; MICROSTRUCTURE

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Other Electrical Engineering, Electronic Engineering, Information Engineering

Identifiers

URN: urn:nbn:se:miun:diva-31590DOI: 10.1016/S0040-6090(99)00130-3OAI: oai:DiVA.org:miun-31590DiVA, id: diva2:1140971

Note

Addresses: Jonsson LB, Univ Uppsala, Angstrom Lab, Box 534, S-75121 Uppsala, Sweden. Univ Uppsala, Angstrom Lab, S-75121 Uppsala, Sweden.

Available from: 2007-03-01 Created: 2017-09-13 Last updated: 2025-09-25Bibliographically approved

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Hedlund, Christer

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