Aspects on bond strength in sheet structures from TMP and CTMP - a reviewShow others and affiliations
2021 (English)In: Nordic Pulp & Paper Research Journal, ISSN 0283-2631, E-ISSN 2000-0669, Vol. 36, no 2, p. 177-213Article, review/survey (Refereed) Published
Abstract [en]
High yield pulps (HYP), manufactured in mechanical and chemimechanical pulping processes, are mainly used in graphic papers and paper grades where a high bulk is preferable, like in paperboards. Moreover, packaging papers with very high demands on both dry and wet strength could be manufactured from HYP in a near future. Preferred bonds between fibre components (long fibres, shortened fibres and fines) in the various paper grades are quite different. In the review, plausible effects of mechanical interlocking, intermolecular interactions ("physical bonding"), hydrogen bonds, intermixing of polymers, additives and possible specific interactions in the formation of strong bonds in sheet structures from HYP are discussed. A required condition for high bond strength in sheets from HYP furnishes is that fibre components are forced into sufficiently close contact. This is to a great extent impeded if the fibre walls are too stiff. Consequently, the current review focuses on both how fibre fractions should preferably be developed for different end uses and how suitable bonds might be achieved in different paper grades. The ideal type of bonds is certainly different depending on the demands on the final paper quality.
Place, publisher, year, edition, pages
2021. Vol. 36, no 2, p. 177-213
Keywords [en]
bond strength, graphic papers, mechanical pulps, packaging paper, paper strength
National Category
Paper, Pulp and Fiber Technology
Identifiers
URN: urn:nbn:se:miun:diva-42767DOI: 10.1515/npprj-2021-0009ISI: 000663328700001Scopus ID: 2-s2.0-85106384979OAI: oai:DiVA.org:miun-42767DiVA, id: diva2:1584145
2021-08-112021-08-112025-09-25