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  • 1.
    Haglund, Daniel
    et al.
    Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
    Hesselbom, Hjalmar
    Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
    Dejanovic, Slavko
    Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
    Metal Covered Elastic Micro-Bump Contacts as an Alternative to Commercial Elastic Interconnection TechniquesManuscript (preprint) (Other (popular science, discussion, etc.))
    Abstract [en]

    In this work, a novel chip-to-board interconnection structure have been manufactured, and some of its characteristics have been investigated. This chip connection technique can for instance serve as a FCOB (Flip Chip on Board) technique, for connecting test equipments during testing bare chip on wafer, and with some more development, in three dimensional multi chip modules. A setup of elastic micro-bumps was cast, metal covered, patterned, and electro-mechanically characterized. The metal-covered silicon elastomer contact-structures were manufactured on FR-4 carrier-plates. Visual inspection of the micro-bumps was conducted in a SEM (Scanning Electron Microscope). The electro-mechanical properties were measured by simultaneous use of a DMA (Dynamic Mechanical Analyzer) and a Kelvin Bridge structure for resistance measurement. The measurements gave the micro-bump to chip resistance behavior as a function of the micro-bump deflection distance and applied mechanical force when direct current was applied. The results obtained from the measurements have revealed that such a technique requires less than one tenth of the mechanical contact force for achieving the contact resistance of the same magnitude as for commercial elastic interconnection techniques. This would be of significant advantage because the amount of electrical contacts per unit of area has tendency of continued growth.

  • 2.
    Hesselbom, Hjalmar
    et al.
    Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
    Norberg, Gunnar
    Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
    Dejanovic, Slavko
    Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
    Haglund, Daniel
    Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
    Solder and adhesive free chip assembly using elastic chip sockets: Concept, Manufacture and Preliminary Investigations2004In: Proceedings of 2004 International IEEE Conference on the Asian Green Electronics (AGEC), Piscataway, NJ, USA: IEEE , 2004, p. 12-17Conference paper (Other academic)
    Abstract [en]

    Flip Chip connections enormously reduces the amount of solder as compared to mounting packaged devices, apart from also offering superior high frequency properties and placement density. However, when assembling chips to substrates having different thermal expansion coefficient, the solder balls are exposed to strain, the more so the denser the connections (and consequently smaller balls), and the higher the power densities, resulting in wider temperature cycles. This will usually result in loss of contact reliability. Using other materials than solder or using underfills may partially improve the situation, but causes other problems. In order to test another concept maintaining or exceeding the excellent HF and density properties of conventional Flip Chip, while practically eliminating the thermal mismatch problems and providing effortless chip replacement, the Elastic Chip Socket was developed. Silicone elastomer was molded in a precision mold made using anisotropic etching of Si. These structures were subsequently metallized and the metal patterned using electro plated resist. So far functional chip sockets with pin densities of 45 000 pins per cm2 (22 500 simultaneously functional connections to a 7 x 7 mm die) and more have been achieved which endure multiple repeated matings and quick temperature cycling between -40 °C and +90 °C. The following is a summary of the group's achievement this far, Oct. 2003

  • 3. Karlsson, Mona
    et al.
    Persson, Ulf
    Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
    Haglund, Daniel
    Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
    Evaluation of Thermal Imaging and Simulation Applicable to Testing of Printed Board Assemblies2004In: THERMINIC 2004 10th international workshop on THERmal INvestigations of ICs and Systems: 29 September - 1 October 2004, Sophia Antipolis, Côte d'Azur, France., Grenoble: Laboratoire TIMA , 2004, p. 119-129Conference paper (Refereed)
    Abstract [en]

    This paper presents a non-contact method for making relative measurements of the resistance of surface mounted resistors. An application of this technique is in automatic test equipment, i.e. within the limitations of resolution and accuracy of the measuring system it is possible to detect if incorrect resistor values are mounted on a printed board assembly. Measurements are made on two specially designed test boards. Two different measurement systems are used of which one is based on thermopiles and the other is a heat camera equipped with a QWIP (Quantum Well Intersubband Photodetector) detector. The detection of a minimum change of resistance, corresponding to a change of approximately 5 mW in dissipated electrical power, was achieved. Simulations of resistor board systems using; THERMIC 6.6, THERMICPCB 6.6, and Flotherm 3.2; and a dissipation power model are presented as a demonstration of predictions of the thermal fingerprint of a circuit board.

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