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  • 1.
    Andersson, Henrik
    et al.
    Mid Sweden University, Faculty of Science, Technology and Media, Department of Electronics Design.
    Sidén, Johan
    Mid Sweden University, Faculty of Science, Technology and Media, Department of Electronics Design.
    Skerved, Vincent
    Mid Sweden University, Faculty of Science, Technology and Media, Department of Electronics Design.
    Li, Xiaotian
    Mid Sweden University, Faculty of Science, Technology and Media, Department of Electronics Design.
    Gyllner, Linnea
    Iniss Triab AB, S-16250 Vällingby.
    Soldering Surface Mount Components onto Inkjet Printed Conductors on Paper Substrate using Industrial Processes2016In: IEEE Transactions on Components, Packaging, and Manufacturing Technology, ISSN 2156-3950, E-ISSN 2156-3985, Vol. 6, no 3, p. 478-485, article id 7422029Article in journal (Refereed)
    Abstract [en]

    This paper describes mounting of standard surface mount component packages on a paper substrate using an industrial solder process with a low-temperature solder. The use of paper as a substrate for printed flexible electronics is becoming more and more widespread as an alternative to the more commonly used plastic substrates, such as polyethylene and polyimide. Paper has the benefits of being environmentally friendly, recyclable, and renewable, as well as inexpensive. It is shown that it is possible to mount standard surface mount device components on paper substrates using low-temperature solder in an industrial soldering process. The contact resistances obtained are mostly low, although the yield of functioning contacts is low. The reason is cracking of the substrate coating layer that goes through the printed silver tracks. It was observed that the cracks appear mostly close to the contact pads, the most likely cause is thermal mismatch between the coating layer and solder and also thermal expansion of the photo paper resin coating. The smallest component package size, 0201, resulted in the highest yield of >80% with decreasing yield for larger package sizes.

  • 2.
    Meng, Xiaozhou
    et al.
    Mid Sweden University, Faculty of Science, Technology and Media, Department of Electronics Design.
    Thörnberg, Benny
    Mid Sweden University, Faculty of Science, Technology and Media, Department of Electronics Design.
    Olsson, Leif
    Mid Sweden University, Faculty of Science, Technology and Media, Department of Information and Communication systems.
    Strategic Proactive Obsolescence Management Model2014In: IEEE Transactions on Components, Packaging, and Manufacturing Technology, ISSN 2156-3950, E-ISSN 2156-3985, Vol. 4, no 6, p. 1099-1108Article in journal (Refereed)
    Abstract [en]

    When there is a demand larger than the corresponding number of components in stock, obsolescence problems may occur for those systems with a life cycle longer than that of one or more of their components, such as automotive, avionics, military application, etc. This paper discusses the electronic component obsolescence problem and presents a formal mathematical strategic proactive obsolescence management model for long life cycle systems.

    The model presented in this paper utilizes redesign and last-time-buy (LTB) as two management methods. LTB cost is estimated by unit cost, demand quantities, buffer, discount rate and holding cost. Redesign cost is associated with component type and quantities.

    This model can estimate the minimum management costs for a system with different architectures. It consists of two parts. The first is to generate a graph, which is in the form of an obsolescence management diagram. A segments table containing the data of this diagram is calculated and prepared for optimization at a second step. This second part is to find the minimum cost for system obsolescence management. Mixed integer linear programming (MILP) is used to calculate the minimum management cost and schedule. The model is open sourced allowing other research groups to freely download and modify it.

    A display and control system case study is shown to apply this model practically. A reactive manner is presented as a comparison. The result of the strategic proactive management model shows significant cost avoidance as compared to the reactive manner.

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