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Soldering Surface Mount Components onto Inkjet Printed Conductors on Paper Substrate using Industrial Processes
Mid Sweden University, Faculty of Science, Technology and Media, Department of Electronics Design.
Mid Sweden University, Faculty of Science, Technology and Media, Department of Electronics Design.
Mid Sweden University, Faculty of Science, Technology and Media, Department of Electronics Design.
Mid Sweden University, Faculty of Science, Technology and Media, Department of Electronics Design.
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2016 (English)In: IEEE Transactions on Components, Packaging, and Manufacturing Technology, ISSN 2156-3950, E-ISSN 2156-3985, Vol. 6, no 3, p. 478-485, article id 7422029Article in journal (Refereed) Published
Abstract [en]

This paper describes mounting of standard surface mount component packages on a paper substrate using an industrial solder process with a low-temperature solder. The use of paper as a substrate for printed flexible electronics is becoming more and more widespread as an alternative to the more commonly used plastic substrates, such as polyethylene and polyimide. Paper has the benefits of being environmentally friendly, recyclable, and renewable, as well as inexpensive. It is shown that it is possible to mount standard surface mount device components on paper substrates using low-temperature solder in an industrial soldering process. The contact resistances obtained are mostly low, although the yield of functioning contacts is low. The reason is cracking of the substrate coating layer that goes through the printed silver tracks. It was observed that the cracks appear mostly close to the contact pads, the most likely cause is thermal mismatch between the coating layer and solder and also thermal expansion of the photo paper resin coating. The smallest component package size, 0201, resulted in the highest yield of >80% with decreasing yield for larger package sizes.

Place, publisher, year, edition, pages
2016. Vol. 6, no 3, p. 478-485, article id 7422029
Keywords [en]
Electronic components, printing, soldering, surface-mount technology
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:miun:diva-26841DOI: 10.1109/TCPMT.2016.2522474ISI: 000372787300017Scopus ID: 2-s2.0-84960154273Local ID: STCOAI: oai:DiVA.org:miun-26841DiVA, id: diva2:891687
Projects
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Funder
Knowledge Foundation, 20130324Available from: 2016-01-07 Created: 2016-01-07 Last updated: 2018-10-12Bibliographically approved
In thesis
1. Flexible Circuits and Materials for Creating Large-Area RFID Reader Antenna Systems
Open this publication in new window or tab >>Flexible Circuits and Materials for Creating Large-Area RFID Reader Antenna Systems
2018 (English)Licentiate thesis, comprehensive summary (Other academic)
Abstract [en]

One of the applications for RFID technology is to monitor and position RFID-tagged objects over large volumes. To achieve this, one possible option is to implement RFID reader antennas, which are relatively thin but with significantly large areas, and place them beneath the RFID-tagged objects.  In order to realise RFID reader antennas with large-areas, circuit materials other than conventional rigid PCB materials should be investigated and utilized. Therefore, this thesis addresses how non-conventional PCB materials can be used to achieve large-area RFID reader antenna structures.

   Non-conventional PCB materials are firstly chosen, which comprises patterned Al-polyimide foil, printed conductive Ag inks onto paper, polyethylene foam as antenna substrate. The physical and electrical properties of the materials are measured. These properties are later used in antenna simulations. In addition, assembly methods, e.g. circuit lamination and VIA fabrication, for the chosen materials are developed. 

   Three novel surface mounting techniques are developed and characterized in this thesis. The techniques are developed for mounting SMD components onto tracks made by Al, a screen printed Ag flake ink, and an inkjet printed Ag nanoparticle ink. These techniques are characterized and evaluated by various methods, including contact resistance measurements, bonding strength tests, and microscopy studies. The characterizations show these techniques have achieved low contact resistance and sufficient bonding strength.

   Based on the previous efforts, two antenna systems, respectively operating on UHF (867 MHz) and HF (13.56 MHz) bands, are fabricated. The two antenna systems are designed into SP4T switching networks, using standard antenna elements as the loads of the network. The input RFID interrogation signals from commercial industrial RFID readers are directed into every antenna element periodically through the SP4T switching networks. Both antenna systems are characterized by means of various RF power attenuation measurements and passive RFID tag interrogation tests. It is shown in the results that both antenna systems have low RF attenuations, potentials to perform passive RFID tag positioning, and possibilities to be expanded to larger areas.

   In the end, based on the antenna system characterization results and design parameters, a great amount of calculation is performed in order to discuss how large the antenna system areas can be as well as how many antenna elements can be achieved in one antenna system. 

Place, publisher, year, edition, pages
Sundsvall: Mid Sweden University, 2018. p. 67
Series
Mid Sweden University licentiate thesis, ISSN 1652-8948 ; 148
National Category
Communication Systems Manufacturing, Surface and Joining Technology
Identifiers
urn:nbn:se:miun:diva-34698 (URN)978-91-88527-79-0 (ISBN)
Presentation
2018-11-15, O102s, Holmgatan 10, Sundsvall, 10:00 (English)
Opponent
Supervisors
Available from: 2018-10-12 Created: 2018-10-12 Last updated: 2018-10-12Bibliographically approved

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Andersson, HenrikSidén, JohanSkerved, VincentLi, Xiaotian

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