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2015 (English)In: Materials Research Express, E-ISSN 2053-1591, Vol. 2, no 8, article id 086501Article in journal (Refereed) Published
Abstract [en]
This article reports on plasma treatment of SU-8 epoxy in order to enhance adhesive strength for metals. Its samples were fabricated on standard silicon wafers and treated with (O2 & Ar) RF plasma at a power of 25W at a low pressure of (3×10-3 torr) for different time spans (10 sec – 70 sec). The sample surfaces were characterized in terms of contact angle, surface (roughness and chemistry) and using a tape test. During the contact angle measurement, it was observed that the contact angle was reduced from 73° to 5° (almost wet) and 23° for (O2 & Ar) treated samples, respectively. The RMS surface roughness was significantly increased by 21.5% and 37.2% for (O2 & Ar) treatment, respectively. A pattern of metal squares was formed on the samples using photolithography for a tape test. An adhesive tape was applied to the samples and peeled off at 180o. The maximum adhesion results, more than 90%, were achieved for the O2-treated samples, whereas the Ar-treated samples showed no change. The XPS study shows the formation of new species in the O2-treated sample compared to the Ar-treated samples. The high adhesive results were due to the formation of hydrophilic groups and new O2 species in the O2-treated samples, which were absent in Ar-treated samples.
Place, publisher, year, edition, pages
Institute of Physics (IOP), 2015
Keywords
SU-8, contact angle, plasma treatment, surface modification, adhesion, tape test, theromocouples
National Category
Other Materials Engineering
Identifiers
urn:nbn:se:miun:diva-26157 (URN)10.1088/2053-1591/2/8/086501 (DOI)000370037800017 ()2-s2.0-84954539766 (Scopus ID)STC (Local ID)STC (Archive number)STC (OAI)
2015-10-282015-10-282022-03-22Bibliographically approved