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Assembling surface mounted components on ink-jet printed double sided paper circuit board
Mid Sweden University, Faculty of Science, Technology and Media, Department of Electronics Design.
Mid Sweden University, Faculty of Science, Technology and Media, Department of Electronics Design.
Mid Sweden University, Faculty of Science, Technology and Media, Department of Electronics Design.
Mid Sweden University, Faculty of Science, Technology and Media, Department of Natural Sciences.ORCID iD: 0000-0001-9137-3440
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2014 (English)In: Nanotechnology, ISSN 0957-4484, E-ISSN 1361-6528, Vol. 25, p. Art. no. 094002-Article in journal (Refereed) Published
Abstract [en]

Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with inkjet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed.

Place, publisher, year, edition, pages
Institute of Physics (IOP), 2014. Vol. 25, p. Art. no. 094002-
Keywords [en]
printed electronics, component mounting, conductive adhesives, ink jet, printed circuit board, silver nano particle ink
National Category
Nano Technology
Identifiers
URN: urn:nbn:se:miun:diva-21474DOI: 10.1088/0957-4484/25/9/094002ISI: 000331573500004Scopus ID: 2-s2.0-84894165167Local ID: STCOAI: oai:DiVA.org:miun-21474DiVA, id: diva2:699679
Available from: 2014-02-28 Created: 2014-02-28 Last updated: 2017-12-05Bibliographically approved

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Andersson, HenrikManuilskiy, AnatoliyHaller, StefanHummelgård, MagnusSidén, JohanHummelgård, ChristineOlin, HåkanNilsson, Hans-Erik

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Andersson, HenrikManuilskiy, AnatoliyHaller, StefanHummelgård, MagnusSidén, JohanHummelgård, ChristineOlin, HåkanNilsson, Hans-Erik
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Department of Electronics DesignDepartment of Natural Sciences
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Nanotechnology
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