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System integration of electronic functions in smart packaging applications
Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.ORCID iD: 0000-0002-3790-0729
Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
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2012 (English)In: IEEE Transactions on Components, Packaging and Manufacturing Technology, ISSN 2156-3950, Vol. 2, no 10, 1723-1734 p.Article in journal (Refereed) Published
Abstract [en]

A system integration scheme relevant for smart packaging applications is presented. Recent advances in printed electronics, radio frequency identification tag production, and standardization of communication protocols are factors that increase the design freedom for new applications. As in all new technology fields, the first products are expected to appear in the high-cost segment attracting early adopters in the form of niche products. A reasonable assumption is that these products will come from hybridization of different types of technologies. Such a scenario is likely since no technology solution available can provide all features that these types of applications demand. There is a need of standard solutions for hybridization of silicon devices and printed (or foil-type) components. Conductive ink technology is a powerful tool for hybridization and customization of large-area electronics, providing 3-D integration and large-area customization. However, high-performance communication and advanced processing demand the use of silicon. Smart hybridization solutions allow combination of the best from both worlds. This paper analyzes the requirements on hybridization technologies suitable for smart packaging applications and provides design examples on integration of intrusion surveillance solutions for cellulose-based packaging applications. It shows that even though the current hybridization technologies are far from optimal, they can provide a considerable design freedom and system performance. © 2011-2012 IEEE.

Place, publisher, year, edition, pages
2012. Vol. 2, no 10, 1723-1734 p.
Keyword [en]
Large area sensors; printed electronics; smart packaging
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:miun:diva-14306DOI: 10.1109/TCPMT.2012.2204056ISI: 000309729400020Scopus ID: 2-s2.0-84867210457Local ID: STCOAI: oai:DiVA.org:miun-14306DiVA: diva2:434401
Available from: 2011-08-15 Created: 2011-08-15 Last updated: 2016-10-20Bibliographically approved
In thesis
1. System integration of electronic functionality in packaging application
Open this publication in new window or tab >>System integration of electronic functionality in packaging application
2011 (English)Doctoral thesis, comprehensive summary (Other academic)
Abstract [en]

Sensor applications are becoming increasingly important as products are now being requested to be more and more intelligent and safe. As the costs involved in sensor technology decrease its usage will spread to new market segments including new areas with products that have never previously used such functionalities, including, wood fibre based products for packaging, hygiene or graphical use. Currently there is a significant interest in developing technology that will allow packages to become interactive and be integrated with digital services accessible on the Internet. In this thesis, the system integration of a hybrid RFID based sensor platform is presented. This proposed platform provides a trade-off between the communication performance and its compatibility with international standards and also includes flexibility in on‐package customization, including the type and number of sensors. In addition it combines the use of traditional silicon based electronics with printed electronics directly onto wood fibre based materials so as to enable the possibility of creating smart packages. Together with the system integration of the sensor platform, five printed moisture sensor concepts that are designed to work with the sensor platform are presented and characterized. Firstly, there is a moisture sensor that shows a good correlation to the moisture content of wood fibre based substrates. The second one involves a sensor that detects high relative humidity levels in the air and the third is an action activated energy cell that provides power when activated by moisture. The fourth one deals with two types of moisture sensors that utilize silver nano-particles in order to measure the relative humidity in the air. The final one is a printable touch sensitive sensor that is sensitive to the moisture contained in the hand. A concept of remote moisture sensing that utilizes ordinary low cost RFID tags has also been presented and characterized.

The main focus is thus on system integration to, by combining silicon based electronics with printed electronics, find the most low cost solution with regards to flexibility, sensor functions and still meet the communication standards.

Abstract [sv]

När efterfrågan på mer intelligenta och säkra produkter ökar så ökar även intresset för olika typer av sensorer. När kostnaden för dessa sensorer sjunker så kommer användandet av dessa att utökas till nya marknadssegment som tidigare inte använt denna typ av funktionalitet, som tillexempel pappersbaserade förpackningar, hygienartiklar och papper för grafiskttryck. Det är för närvarande ett stort intresse att utveckla tekniker som tillåter förpackningar att bli interaktiva och integrerade med olika digitala tjänster kopplade till Internet. I denna avhandling så presenteras systemintegrationen av en RFID baserad sensor plattform som tillhandahåller en avvägning mellan kommunikationsprestanda, kompabilitet med internationella standarder och kundanpassningsflexibilitet. Där man direkt på förpackningen kombinerar fördelarna med traditionell kiselbaserad elektronik med trycktelektronik för att kunna skapa intelligenta förpackningar. I avhandlingen presenteras och utvärderas även fem trycka fuktsensorer som är designade att kunna användas tillsammans med sensor plattformen. Den första sensorn mäter fukthalten i cellulosabaserade substrat. Den andra kan detektera höga fukthalter i luften. Den tredje, som aktiveras vid en händelse, producerar en elektrisk ström när den blir fuktig. Den fjärde sensorn använder sig av silverbaserade partiklar i nanostorlek för att mäta fukthalten i luften. Den femte sensorn är en beröringskänslig sensor som ger utslag av fukten i handen. Utöver dessa sensorer så utvärderas även ett koncept med en fuktsensor som kan läsas av på avstånd.

Fokus är således att på system integrationsnivå, med hjälp av att kombinera kisel elektronik med tryckt elektronik, hitta den mest kostnadseffektiva lösningen med avseende på flexibilitet, sensor funktionalitet och att även kunna möta kommunikationsstandarderna.

Place, publisher, year, edition, pages
Sundsvall: Mid Sweden University, 2011. 97 p.
Series
Mid Sweden University doctoral thesis, ISSN 1652-893X ; 112
Keyword
sensor platform, RFID, printed electronics, moisture sensors
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:miun:diva-14311 (URN)STC (Local ID)978‐91‐86694‐49‐4 (ISBN)STC (Archive number)STC (OAI)
Public defence
2011-09-23, O102, Holmgatan 10, Sundsvall, 13:00 (English)
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Supervisors
Available from: 2011-08-16 Created: 2011-08-15 Last updated: 2016-10-19Bibliographically approved

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Nilsson, Hans-ErikUnander, TomasAndersson, HenrikManuilskiy, AnatoliySidén, JohanGulliksson, Mikael
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