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New solutions for high frequency electronic packaging
Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
2003 (English)In: 2003 IEEE International Symposium on Electromagnetic Compatibility (EMC), Vols 1 and 2, Symposium Record, 2003, 954-957 p.Conference paper, Published paper (Refereed)
Abstract [en]

A new concept for shielded enclosures of electronics is presented in this paper. An inexpensive doubled heatsink in extruded aluminum forms the base of the enclosure. The electronics are inserted into one part and is enclosed by a complementary shielding surface. The outer heatsink is cooled by forced ventilation. As openings are made redundant, seams between the parts of the enclosure are the only path for significant electromagnetic emissions.

Place, publisher, year, edition, pages
2003. 954-957 p.
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:miun:diva-13613ISI: 000228094500248ISBN: 0-7803-7779-6 (print)OAI: oai:DiVA.org:miun-13613DiVA: diva2:411739
Conference
IEEE International Symposium on Electromagnetic Compatibility (EMC), may 11-16, 2003, Istanbul, Turkey
Available from: 2011-04-19 Created: 2011-04-19Bibliographically approved

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CiteExportLink to record
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Citation style
  • apa
  • ieee
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