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High frequency design and characterization of SU-8 based conductor backed coplanar waveguide transmission lines
Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
2005 (English)In: Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, IEEE conference proceedings, 2005, p. 243-248, article id 1432083Conference paper, Published paper (Refereed)
Abstract [en]

The epoxy-based negative photoresist SU8 is widely used within the MEMS (Micro-Electro-Mechanical Systems) community, and is well known for its ability to form thick layers with high aspect ratios and for its chemical resistance. However, only a few papers have investigated the electrical properties of this material and mostly within the MEMS area or at lower frequency ranges.

This paper presents the design and characterization of conductor-backed coplanar waveguide (CBCPW) transmission lines using SU-8 dielectric material. The coplanar transmission lines are carefully designed using EDA tools, and fabricated on a metallized glass substrate coated with SU-8 material. S-parameter measurements are performed from 45 MHz to 50 GHz using a vector network analyzer and a probe station. From these measurements, transmission line parameters such as characteristic impedance, attenuation constant, effective dielectric constant, loss tangent, etc, are determined. The design procedure, fabrication process and measurement results are described in this paper.

To our knowledge, this is the first time the SU-8 material is characterized in Microelectronics using CBCPW transmission lines.

Place, publisher, year, edition, pages
IEEE conference proceedings, 2005. p. 243-248, article id 1432083
Keywords [en]
microwave measurements; conductor-backed coplanar waveguides (CBCPW) transmission lines; coplanar waveguides (CPW); dielectric measurement; high frequency electrical characterization
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:miun:diva-11863DOI: 10.1109/ISAPM.2005.1432083ISI: 000230430400050Scopus ID: 2-s2.0-33746556795ISBN: 0-7803-9085-7 (print)OAI: oai:DiVA.org:miun-11863DiVA, id: diva2:330532
Conference
2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces; Irvine, CA; United States; 16 March 2005 through 18 March 2005
Available from: 2010-07-15 Created: 2010-07-15 Last updated: 2016-09-29Bibliographically approved

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Hesselbom, Hjalmar

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CiteExportLink to record
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Citation style
  • apa
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