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Manufacturing of Via Holes in Silicone Elastomer
Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
(English)Manuscript (Other (popular science, discussion, etc.))
Abstract [en]

In this work a possibility of making via holes in silicone elastomer was investigated. The methods that were taken into consideration were punching, mechanical drilling, laser drilling and RIE. Laser drilling and RIE were found to be viable and both were tried. Laser drilling of silicone elastomer has shown a big problem with burnt residues and has to be investigated much further to be usable. RIE of silicone elastomer is reported in this work. Several phenomena were observed. The etch-residues can be removed by washing them away in an ultra sonic water bath and subsequently totally removed by using a lift-off process based on wet Cu etch. A good anisotropy was achieved by applying CF4 plasma. Gradually broadening of the openings in the etch mask has contributed to a favorable etch profile and thus easier metallization of side-walls of via holes.

Keywords [en]
silicone elastomer, dry etch, RIE, via hole
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:miun:diva-6246Local ID: 2685OAI: oai:DiVA.org:miun-6246DiVA, id: diva2:31285
Note
Submitted to IEEE Transaction on Components and Packaging Technologies, Feb 2004Available from: 2009-02-18 Created: 2009-02-18 Last updated: 2011-04-08Bibliographically approved

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Dejanovic, SlavkoHesselbom, HjalmarNorberg, Gunnar

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