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Buried Schottky Contacts in Patterned Cobalt Silicide Layers in Silicon Using Wafer Bonding
Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.ORCID iD: 0000-0002-8325-5177
Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
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1994 (English)In: Proceedings of the MRS Symposium, 1994, p. 475-480Conference paper, Published paper (Other academic)
Place, publisher, year, edition, pages
1994. p. 475-480
Series
Materials Research Society Symposium - Proceedings, ISSN 0272-9172
Keywords [en]
Cobalt silicide wafer bonding
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:miun:diva-5505Local ID: 768OAI: oai:DiVA.org:miun-5505DiVA, id: diva2:30538
Available from: 2008-12-11 Created: 2008-12-11 Last updated: 2011-04-12Bibliographically approved

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Thungström, GöranFröjdh, ChristerPetersson, Sture

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CiteExportLink to record
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