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Solder and adhesive free chip assembly using elastic chip sockets: Concept, Manufacture and Preliminary Investigations
Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
2004 (English)In: Proceedings of 2004 International IEEE Conference on the Asian Green Electronics (AGEC), Piscataway, NJ, USA: IEEE , 2004, 12-17 p.Conference paper, (Other academic)
Abstract [en]

Flip Chip connections enormously reduces the amount of solder as compared to mounting packaged devices, apart from also offering superior high frequency properties and placement density. However, when assembling chips to substrates having different thermal expansion coefficient, the solder balls are exposed to strain, the more so the denser the connections (and consequently smaller balls), and the higher the power densities, resulting in wider temperature cycles. This will usually result in loss of contact reliability. Using other materials than solder or using underfills may partially improve the situation, but causes other problems. In order to test another concept maintaining or exceeding the excellent HF and density properties of conventional Flip Chip, while practically eliminating the thermal mismatch problems and providing effortless chip replacement, the Elastic Chip Socket was developed. Silicone elastomer was molded in a precision mold made using anisotropic etching of Si. These structures were subsequently metallized and the metal patterned using electro plated resist. So far functional chip sockets with pin densities of 45 000 pins per cm2 (22 500 simultaneously functional connections to a 7 x 7 mm die) and more have been achieved which endure multiple repeated matings and quick temperature cycling between -40 °C and +90 °C. The following is a summary of the group's achievement this far, Oct. 2003

Place, publisher, year, edition, pages
Piscataway, NJ, USA: IEEE , 2004. 12-17 p.
Keyword [en]
Chip Assembly
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:miun:diva-928DOI: 10.1109/AGEC.2004.1290858Local ID: 2792ISBN: 0-7803-8203-X (print)OAI: oai:DiVA.org:miun-928DiVA: diva2:25960
Available from: 2008-09-30 Created: 2008-09-30 Last updated: 2011-04-08Bibliographically approved

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Hesselbom, HjalmarNorberg, GunnarDejanovic, SlavkoHaglund, Daniel
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Department of Information Technology and Media
Electrical Engineering, Electronic Engineering, Information Engineering

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CiteExportLink to record
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Citation style
  • apa
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Language
  • de-DE
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