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Processing and characterization of a MEDIPIX2-compatible silicon sensor with 220 mu m pixel size
Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media. (STC)
Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media. (Electronics design division)
Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media. (STC)ORCID iD: 0000-0002-8325-5177
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2011 (English)In: Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, ISSN 0168-9002, E-ISSN 1872-9576, Vol. 633, no Suppl 1, p. S78-S80Article in journal (Refereed) Published
Abstract [en]

Pixellated silicon detectors with a pixel size of 220 um have been fabricated at Mid Sweden University. The detectors will be bonded to the MEDIPIX2 [1] readout chip. The purpose is to investigate the performance of an energy sensitive X-ray imaging sensor with reduced charge sharing.

The detectors were fabricated on high purity silicon with a wafer thickness of 500 um and a resistivity of more than 15 kohmcm. One reason for the choice of material was to get experience for future work with very thick detectors requiring ultra high resistivity in order to be depleted. During the initial work in this project some issued were found concerning inter pixel resistance and the efficiency of the guard rings. This led to a study of existing papers on the subject [2,3,4,5] and to extensive simulations of the electric field and the charge transport in different parts of the device.

A modified process has been developed using alternating p+ and n+ guard rings and an outer n+ doping. The results of the simulations and the process will be described as well as an outline for a process for fabrication of very thick detectors with limited guard ring extension.

References[1] - X. Llopart, M. Campbell, R. Dinapoli, D. San Segundo and E. Pernigotti, IEEE Trans. Nucl. Sci., vol. 49, 2279-2283, October 2002.[2] – L. Evensen, A. Hanneborg, B Sundby Avset, M. Mese, Nuclear Instruments and Methods in Physics Research A 337 (1993) 44 – 52[3] – T. Pavalainen, T. Tuuva, K. Leinonen, Nuclear Instruments and Methods in Physics Research A 573 (2007) 277 – 279[4] – Z. Li, W. Huang, L. J. Zhao, IEEE Trans. Nucl. Sci., vol. 47, No. 3. 729 – 735 , June 2000.[5] – D. Han, C. Wang, G. Wang, S. Du, L. Shen, X. Tian, X. Zhang, IEEE Transactions on Electron devices, Vol. 50, No. 2, 537 – 540, February 2003

Place, publisher, year, edition, pages
2011. Vol. 633, no Suppl 1, p. S78-S80
Keywords [en]
X-ray spectroscopy; Pixel detector; MEDIPIX; Charge sharing
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:miun:diva-9672DOI: 10.1016/j.nima.2010.06.128ISI: 000292782400023Scopus ID: 2-s2.0-79959815743Local ID: STCOAI: oai:DiVA.org:miun-9672DiVA, id: diva2:235731
Conference
11th International Workshop on Radiation Imaging Detectors Location: Czech Technical Univ, Inst Experimental & Applied Phys, Prague, CZECH REPUBLIC Date: JUN 29-JUL 03, 2009
Available from: 2009-09-17 Created: 2009-09-17 Last updated: 2018-02-26Bibliographically approved

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Fröjdh, AnnaFröjdh, ErikThungström, GöranFröjdh, ChristerNorlin, Börje

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Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
Electrical Engineering, Electronic Engineering, Information Engineering

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