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Solder connections for high frequency applications between flexible and rigid printed circuit boards
Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
2006 (English)In: IEEE transactions on components and packaging technologies (Print), ISSN 1521-3331, E-ISSN 1557-9972, Vol. 29, no 1, p. 118-126Article in journal (Refereed) Published
Abstract [en]

This article examines the backplane connector technology for high frequency use and presents a novel concept for shielded enclosures without air vents. The experimental soldering of connections between a flexible printed circuit (flex, for short) and a FR4-board as part of a backplane connector is presented. A very high contact density is reached by soldering vias on the flex to pads on the FR4; this soldering was performed both with ordinary Sn/Pb solder material and as well with lead-free solder alloy. The solder joints were examined using a scanning electron microscope (SEM) and the electrical properties of the flex/solder joint structure were measured.

Place, publisher, year, edition, pages
2006. Vol. 29, no 1, p. 118-126
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:miun:diva-8693DOI: 10.1109/TCAPT.2005.853164ISI: 000235900500015Scopus ID: 2-s2.0-33644793149OAI: oai:DiVA.org:miun-8693DiVA, id: diva2:175043
Note

VR-Materials Science

Available from: 2009-02-26 Created: 2009-02-26 Last updated: 2017-12-13Bibliographically approved

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Siebert, W Peter

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