Analysis of MEMS devices under temperature stress testShow others and affiliations
2021 (English)In: 2021 IEEE International Workshop on Metrology for AeroSpace, MetroAeroSpace 2021 - Proceedings, Institute of Electrical and Electronics Engineers Inc. , 2021, p. 63-68Conference paper (Refereed)
Abstract [en]
The current technological process has mainly interested in integrating MEMS devices in most technological devices to offer complete control and awareness about a particular process or system. Such devices, which in most cases include gyroscope, accelerometer, and magnetometer, are fully integrated on a single chip and have a cost not higher than few dollars. Recently they have been more employed in embedded systems devoted to the autonomous driving operation for terrestrial and aeronautical vehicles. Such devices are often deployed to the market with datasheet reporting their characteristic without highlighting their behavior under particular environmental conditions. Most MEMS devices are mounted in a very harsh environment, characterized by high-temperature excursion and vibration from different sources. The authors propose a temperature stress test for such devices and evaluate their behavior under static conditions. Experimental results will evidence the accelerometer and gyroscope MEMS sensors' dependence on the temperature in a range of -10°C to 50°C. © 2021 IEEE.
Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers Inc. , 2021. p. 63-68
Keywords [en]
Accelerometer, Gyroscope, Inertial Measurement Unit, MEMS, Temperature, Testing, Accelerometers, Gyroscopes, Autonomous driving, Environmental conditions, Fully integrated, Harsh environment, High temperature, Static conditions, Technological process, Temperature stress, Embedded systems
Identifiers
URN: urn:nbn:se:miun:diva-43067DOI: 10.1109/MetroAeroSpace51421.2021.9511744Scopus ID: 2-s2.0-85114053984ISBN: 9781728175560 (print)OAI: oai:DiVA.org:miun-43067DiVA, id: diva2:1595688
Note
Export Date: 20 September 2021; Conference Paper
2021-09-202021-09-202021-09-20Bibliographically approved