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A Novel Dry Selective Isotropic Atomic Layer Etching of SiGe for Manufacturing Vertical Nanowire Array with Diameter Less than 20 nm
Chinese Acad Sci, Inst Microelect, Key Lab Microelect Devices & Integrated Technol, Beijing 100029, Peoples R China.;Univ Chinese Acad Sci, Microelect Inst, Beijing 100049, Peoples R China..ORCID iD: 0000-0001-5191-7992
Chinese Acad Sci, Inst Microelect, Key Lab Microelect Devices & Integrated Technol, Beijing 100029, Peoples R China..ORCID iD: 0000-0002-5590-861X
Chinese Acad Sci, Inst Microelect, Key Lab Microelect Devices & Integrated Technol, Beijing 100029, Peoples R China..
Chinese Acad Sci, Inst Microelect, Key Lab Microelect Devices & Integrated Technol, Beijing 100029, Peoples R China.;Univ Chinese Acad Sci, Microelect Inst, Beijing 100049, Peoples R China..
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2020 (English)In: Materials, E-ISSN 1996-1944, Vol. 13, no 3, article id 771Article in journal (Refereed) Published
Abstract [en]

Semiconductor nanowires have great application prospects in field effect transistors and sensors. In this study, the process and challenges of manufacturing vertical SiGe/Si nanowire array by using the conventional lithography and novel dry atomic layer etching technology. The final results demonstrate that vertical nanowires with a diameter less than 20 nm can be obtained. The diameter of nanowires is adjustable with an accuracy error less than 0.3 nm. This technology provides a new way for advanced 3D transistors and sensors.

Place, publisher, year, edition, pages
2020. Vol. 13, no 3, article id 771
National Category
Condensed Matter Physics
Identifiers
URN: urn:nbn:se:miun:diva-38982DOI: 10.3390/ma13030771ISI: 000515503100278PubMedID: 32046197Scopus ID: 2-s2.0-85079620482OAI: oai:DiVA.org:miun-38982DiVA, id: diva2:1427966
Available from: 2020-05-04 Created: 2020-05-04 Last updated: 2024-07-04

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Radamson, Henry H.

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Li, JunjieLi, YongliangYang, HongRadamson, Henry H.
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