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On the problem of using guard traces for high frequency differential lines crosstalk reduction
Royal Institute of Technology, Stockholm.
Mid Sweden University, Faculty of Science, Technology and Media, Department of Information Technology and Media.
2007 (English)In: IEEE transactions on components and packaging technologies (Print), ISSN 1521-3331, E-ISSN 1557-9972, Vol. 30, no 1, p. 67-74Article in journal (Refereed) Published
Abstract [en]

In this paper, the problem of using guard traces for reducing crosstalk between differential transmission line pairs is investigated, both experimentally and by full-wave electromagnetic (EM) simulations. Different cases of differential lines crosstalk are treated with and without guard trace separation between the differential line pairs. Coated microstrip printed circuit board test structures including thru-reflect-line calibration standards are designed and fabricated on a high frequency laminate material, allowing direct measurement of crosstalk between adjacent differential line pairs in the absence and in the presence of guard traces stitched with vias of regular spacing. The test structures are characterized with mixed-mode scattering parameters using a physical layer test system. Different configurations (of differential line pairs) without guard trace, with floating guard traces (which are terminated and nonterminated) and with a solid guard trace separation are investigated using a High Frequency Structure Simulator (a commercial full-wave 3-D EM simulation tool). The experimental data are compared with the simulation results, and some conclusions and guidelines on the effect of guard traces for alleviating crosstalk between differential transmission lines are presented.

Place, publisher, year, edition, pages
2007. Vol. 30, no 1, p. 67-74
Keywords [en]
Coated microstrip differential transmission lines, Coupling, Guard trace, High frequency crosstalk, S-parameters measurement, Signal integrity, Thru-reflect-line (TRL) calibration
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:miun:diva-8469DOI: 10.1109/TCAPT.2007.892072ISI: 000245418400009Scopus ID: 2-s2.0-34147122524OAI: oai:DiVA.org:miun-8469DiVA, id: diva2:139829
Note

VR-Materials Science

Available from: 2009-01-26 Created: 2009-01-26 Last updated: 2017-12-14Bibliographically approved

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Siebert, W PeterHesselbom, Hjalmar

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CiteExportLink to record
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Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
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Output format
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  • asciidoc
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