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Progress on TSV technology for Medipix3RX chip
Deutsch Elektronen Synchrotron DESY, Ctr Free Electron Laser Sci CFEL, Photon Sci Detector Grp, Hamburg, Germany.
Deutsch Elektronen Synchrotron DESY, Ctr Free Electron Laser Sci CFEL, Photon Sci Detector Grp, Hamburg, Germany.
Deutsch Elektronen Synchrotron DESY, Ctr Free Electron Laser Sci CFEL, Photon Sci Detector Grp, Hamburg, Germany.
IZM, Fraunhofer Inst Reliabil & Microintegrat, Berlin, Germany.
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2017 (English)In: Journal of Instrumentation, ISSN 1748-0221, E-ISSN 1748-0221, Vol. 12, article id C12042Article in journal (Refereed) Published
Abstract [en]

The progress of Through Silicon Via (TSV) technology for Medipix3RX chip done at DESY is presented here. The goal of this development is to replace the wire bonds in X-ray detectors with TSVs, in order to reduce the dead area between detectors. We obtained the first working chips assembled together with Si based sensors for X-ray detection. The 3D integration technology, including TSV, Re-distribution layer deposition, bump bonding to the Si sensor and bump bonding to the carrier PCB, was done by Fraunhofer Institute IZM in Berlin. After assembly, the module was successfully tested by recording background radiation and making X-ray images of small objects. The active area of the Medipix3RX chip is 14.1 mm x 14.1 mm or 256 x 256 pixels. During TSV processing, the Medipix3RX chip was thinned from 775 mu m original thickness, to 130 mu m. The diameter of the vias is 40 mu m, and the pitch between the vias is 120 mu m. A liner filling approach was used to contact the TSV with the RDL on the backside of the Medipix3RX readout chip.

Place, publisher, year, edition, pages
2017. Vol. 12, article id C12042
Keywords [en]
Manufacturing, Front-end electronics for detector readout, Materials for solid-state detectors
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:miun:diva-32739DOI: 10.1088/1748-0221/12/12/C12042ISI: 000418397300004Scopus ID: 2-s2.0-85039787606OAI: oai:DiVA.org:miun-32739DiVA, id: diva2:1177421
Conference
19th International Workshop on Radiation Imaging Detectors (IWORID), AGH Univ Sci & Technol, Krakow, POLAND, JUL 02-06, 2017
Available from: 2018-01-25 Created: 2018-01-25 Last updated: 2018-03-23Bibliographically approved

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Graafsma, Heinz

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