miun.sePublications
Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Soldering surface mount components on screen printed Ag patterns on paper and Polyimide substrates for hybrid printed electronics
Mid Sweden University, Faculty of Science, Technology and Media, Department of Electronics Design. (STC)ORCID iD: 0000-0002-1125-1150
Mid Sweden University, Faculty of Science, Technology and Media, Department of Electronics Design. (STC)ORCID iD: 0000-0003-2965-0288
Mid Sweden University, Faculty of Science, Technology and Media, Department of Electronics Design. (STC)
Atlas Ind Print & Motala AB, Motala.
2018 (English)In: Flexible and Printed Electronics, ISSN 2058-8585, Vol. 3, no 1, article id 015003Article in journal (Refereed) Published
Abstract [en]

The development of printed electronics on flexible substrates is increasing rapidly, where the main benefit is large area and low cost. However, the functionality and performance of printed circuits cannot compete with standard silicon based microprocessors or integrated circuits, though the functionality and performance of printed circuits are increasing. Therefore, in this work we investigate the possibilities of using Sn42/Bi57.6/Ag0.4 low-temperature solder paste together with a reflow solder oven and hot air solder iron to mount regular SMD components on screen-printed silver tracks. It was found that it is possible to solder standard Si SMD pack-ages onto screen-printed Ag ink tracks on paper substrate, however, the component bonding strength to Polyimide were not satisfactory. The resistance of the solder joints was found to be no more than 240 mΩ. The bond strength was found to be higher using the manual hot air sol-der iron than the reflow solder oven. Bending tests show that the bonding strength is higher for the hot air soldered components. Reference samples on FR-4 based copper PCB show a bond strength ~10 times higher but we conclude that it is possible to solder regular Si SMD components onto Ag-printed conductors on paper substrate with good results. The process could be used to fabricate hybrid printed electronics on a standard solder process line.

Place, publisher, year, edition, pages
2018. Vol. 3, no 1, article id 015003
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:miun:diva-32305DOI: 10.1088/2058-8585/aa9dc7ISI: 000423451500001OAI: oai:DiVA.org:miun-32305DiVA: diva2:1163380
Projects
IDPOS
Available from: 2017-12-06 Created: 2017-12-06 Last updated: 2018-02-22Bibliographically approved

Open Access in DiVA

No full text in DiVA

Other links

Publisher's full text

Authority records BETA

Li, XiaotianAndersson, HenrikSidén, Johan

Search in DiVA

By author/editor
Li, XiaotianAndersson, HenrikSidén, Johan
By organisation
Department of Electronics Design
Other Electrical Engineering, Electronic Engineering, Information Engineering

Search outside of DiVA

GoogleGoogle Scholar

doi
urn-nbn

Altmetric score

doi
urn-nbn
Total: 42 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf