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Soldering surface mount components on screen printed Ag patterns on paper and Polyimide substrates for hybrid printed electronics
Mid Sweden University, Faculty of Science, Technology and Media, Department of Electronics Design. (STC)ORCID iD: 0000-0002-1125-1150
Mid Sweden University, Faculty of Science, Technology and Media, Department of Electronics Design. (STC)ORCID iD: 0000-0003-2965-0288
Mid Sweden University, Faculty of Science, Technology and Media, Department of Electronics Design. (STC)
Atlas Ind Print & Motala AB, Motala.
2018 (English)In: Flexible and Printed Electronics, ISSN 2058-8585, Vol. 3, no 1, article id 015003Article in journal (Refereed) Published
Abstract [en]

The development of printed electronics on flexible substrates is increasing rapidly, where the main benefit is large area and low cost. However, the functionality and performance of printed circuits cannot compete with standard silicon based microprocessors or integrated circuits, though the functionality and performance of printed circuits are increasing. Therefore, in this work we investigate the possibilities of using Sn42/Bi57.6/Ag0.4 low-temperature solder paste together with a reflow solder oven and hot air solder iron to mount regular SMD components on screen-printed silver tracks. It was found that it is possible to solder standard Si SMD pack-ages onto screen-printed Ag ink tracks on paper substrate, however, the component bonding strength to Polyimide were not satisfactory. The resistance of the solder joints was found to be no more than 240 mΩ. The bond strength was found to be higher using the manual hot air sol-der iron than the reflow solder oven. Bending tests show that the bonding strength is higher for the hot air soldered components. Reference samples on FR-4 based copper PCB show a bond strength ~10 times higher but we conclude that it is possible to solder regular Si SMD components onto Ag-printed conductors on paper substrate with good results. The process could be used to fabricate hybrid printed electronics on a standard solder process line.

Place, publisher, year, edition, pages
2018. Vol. 3, no 1, article id 015003
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:miun:diva-32305DOI: 10.1088/2058-8585/aa9dc7ISI: 000423451500001Scopus ID: 2-s2.0-85045650822OAI: oai:DiVA.org:miun-32305DiVA, id: diva2:1163380
Projects
IDPOSAvailable from: 2017-12-06 Created: 2017-12-06 Last updated: 2018-10-12Bibliographically approved
In thesis
1. Flexible Circuits and Materials for Creating Large-Area RFID Reader Antenna Systems
Open this publication in new window or tab >>Flexible Circuits and Materials for Creating Large-Area RFID Reader Antenna Systems
2018 (English)Licentiate thesis, comprehensive summary (Other academic)
Abstract [en]

One of the applications for RFID technology is to monitor and position RFID-tagged objects over large volumes. To achieve this, one possible option is to implement RFID reader antennas, which are relatively thin but with significantly large areas, and place them beneath the RFID-tagged objects.  In order to realise RFID reader antennas with large-areas, circuit materials other than conventional rigid PCB materials should be investigated and utilized. Therefore, this thesis addresses how non-conventional PCB materials can be used to achieve large-area RFID reader antenna structures.

   Non-conventional PCB materials are firstly chosen, which comprises patterned Al-polyimide foil, printed conductive Ag inks onto paper, polyethylene foam as antenna substrate. The physical and electrical properties of the materials are measured. These properties are later used in antenna simulations. In addition, assembly methods, e.g. circuit lamination and VIA fabrication, for the chosen materials are developed. 

   Three novel surface mounting techniques are developed and characterized in this thesis. The techniques are developed for mounting SMD components onto tracks made by Al, a screen printed Ag flake ink, and an inkjet printed Ag nanoparticle ink. These techniques are characterized and evaluated by various methods, including contact resistance measurements, bonding strength tests, and microscopy studies. The characterizations show these techniques have achieved low contact resistance and sufficient bonding strength.

   Based on the previous efforts, two antenna systems, respectively operating on UHF (867 MHz) and HF (13.56 MHz) bands, are fabricated. The two antenna systems are designed into SP4T switching networks, using standard antenna elements as the loads of the network. The input RFID interrogation signals from commercial industrial RFID readers are directed into every antenna element periodically through the SP4T switching networks. Both antenna systems are characterized by means of various RF power attenuation measurements and passive RFID tag interrogation tests. It is shown in the results that both antenna systems have low RF attenuations, potentials to perform passive RFID tag positioning, and possibilities to be expanded to larger areas.

   In the end, based on the antenna system characterization results and design parameters, a great amount of calculation is performed in order to discuss how large the antenna system areas can be as well as how many antenna elements can be achieved in one antenna system. 

Place, publisher, year, edition, pages
Sundsvall: Mid Sweden University, 2018. p. 67
Series
Mid Sweden University licentiate thesis, ISSN 1652-8948 ; 148
National Category
Communication Systems Manufacturing, Surface and Joining Technology
Identifiers
urn:nbn:se:miun:diva-34698 (URN)978-91-88527-79-0 (ISBN)
Presentation
2018-11-15, O102s, Holmgatan 10, Sundsvall, 10:00 (English)
Opponent
Supervisors
Available from: 2018-10-12 Created: 2018-10-12 Last updated: 2018-10-12Bibliographically approved

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Li, XiaotianAndersson, HenrikSidén, Johan

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