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Oxygen plasma wafer bonding evaluated by the weibull fracture probability method
Uppsala universitet, Institutionen för materialvetenskap.
Uppsala universitet, Institutionen för materialvetenskap.
Uppsala universitet, Institutionen för materialvetenskap.ORCID iD: 0000-0003-2352-9006
Uppsala universitet, Institutionen för materialvetenskap.
2000 (English)In: Proc of the Eleventh Micromechanics Europe Workshop, Oct, Uppsala, Sweden, 2000Conference paper, Published paper (Refereed)
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2000.
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Other Electrical Engineering, Electronic Engineering, Information Engineering
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URN: urn:nbn:se:miun:diva-31587OAI: oai:DiVA.org:miun-31587DiVA, id: diva2:1140988
Available from: 2007-02-28 Created: 2017-09-13 Last updated: 2017-09-13Bibliographically approved

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Hedlund, Christer

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CiteExportLink to record
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