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Damages in oxygen plasma bonding
Uppsala universitet, Institutionen för materialvetenskap.
Uppsala universitet, Institutionen för materialvetenskap.ORCID iD: 0000-0003-2352-9006
Uppsala universitet, Institutionen för materialvetenskap.
1999 (English)In: The 5th Int Symp Semicind Wafer Bond, 196th Electrochem Soc Meeting, Honolulu, Hawaii Abstract no 1001, 1999Conference paper (Refereed)
Place, publisher, year, edition, pages
1999.
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Other Electrical Engineering, Electronic Engineering, Information Engineering
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URN: urn:nbn:se:miun:diva-31599OAI: oai:DiVA.org:miun-31599DiVA, id: diva2:1140945
Conference
The 5th Int Symp Semicind Wafer Bond, 196th Electrochem Soc Meeting, Honolulu, Hawaii
Available from: 2007-02-28 Created: 2017-09-13 Last updated: 2017-09-13Bibliographically approved

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Hedlund, Christer

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