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AGIPD, the electronics for a high speed X-ray imager at the Eu-XFEL
Deutsches Elektronen-Synchrotron DESY, Hamburg, Germany.
Deutsches Elektronen-Synchrotron DESY, Hamburg, Germany.
Deutsches Elektronen-Synchrotron DESY, Hamburg, Germany.
Deutsches Elektronen-Synchrotron DESY, Hamburg, Germany.
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2014 (English)In: Proceedings of Science, Proceedings of Science (PoS) , 2014, 253Conference paper, Published paper (Refereed)
Abstract [en]

The AGIPD (Adaptive Gain Integrated Pixel Detector) X-ray imaging camera will be operated at the X-ray Free Electron Laser, Eu-XFEL, under construction in Hamburg, Germany. Key parameters are 1 million 200 μm square pixels, single 12.4 keV photon detection and a dynamic range to 10 000/pixel/image. The developed sensors, ASICs, PCB-electronics and FPGA firmware acquire individual images per bunch at 27 000 bunches/s, packed into 10 bunch-trains/s with a bunch separation of 222 ns. Bunch-trains are handled by 352 analogue storage cells within each pixel of the ASIC and written during the 0.6msec train delivery. Therefore AGIPD can store 3520 images/s from the delivered 27 000 bunches/s. Random addressing provides reusability of each cell after an image has been declared as low-quality, so that good images can be selected. Digitization is performed between trains (99.4 msec). In the paper all functional blocks are introduced. The details concentrate on the DAQ-chain PCB-electronics and the slow control. A dense area of 1024 ADC-channels, each with a pickup-noise filtering and sampling of up to 50 MS/s/ADC and a serial output of 700 Mbit/s/ADC. FPGAs operate the ASICs synchronized to the bunch structure and collect the bit streams from 64 ADCs/FPGA. Pre-sorted data is transmitted on 10 GbE links out of the camera head using the time between trains. The control and monitoring of the camera with 600 A current consumption is based on a micro-controller and I2C bus with an addressing architecture allowing many devices and identical modules. The high currents require planned return paths at the system level. First experimental experience with the constructed components will be presented.

Place, publisher, year, edition, pages
Proceedings of Science (PoS) , 2014. 253
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:miun:diva-31125Scopus ID: 2-s2.0-85011620458OAI: oai:DiVA.org:miun-31125DiVA: diva2:1119163
Conference
3rd Technology and Instrumentation in Particle Physics Conference, TIPP 2014, 2 June 2014 through 6 June 2014, Amsterdam; Netherlands
Note

Conference code: 125937; Export Date: 3 July 2017; Conference Paper

Available from: 2017-07-03 Created: 2017-07-03 Last updated: 2017-07-03Bibliographically approved

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Graafsma, Heinz

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