Germanium "hexa" detector: Production and testing
2017 (English)In: Journal of Instrumentation, ISSN 1748-0221, E-ISSN 1748-0221, Vol. 12, no 1, C01068Article in journal (Refereed) Published
Here we present new result on the testing of a Germanium sensor for X-ray radiation. The system is made of 3 × 2 Medipix3RX chips, bump-bonded to a monolithic sensor, and is called "hexa". Its dimensions are 45 × 30 mm2 and the sensor thickness was 1.5 mm. The total number of the pixels is 393216 in the matrix 768 × 512 with pixel pitch 55 μ m. Medipix3RX read-out chip provides photon counting read-out with single photon sensitivity. The sensor is cooled to -126°C and noise levels together with flat field response are measured. For -200 V polarization bias, leakage current was 4.4 mA (3.2 μ A/mm2). Due to higher leakage around 2.5% of all pixels stay non-responsive. More than 99% of all pixels are bump bonded correctly. In this paper we present the experimental set-up, threshold equalization procedure, image acquisition and the technique for bump bond quality estimate.
Place, publisher, year, edition, pages
2017. Vol. 12, no 1, C01068
Hybrid detectors, Materials for solid-state detectors, Solid state detectors, X-ray detectors
IdentifiersURN: urn:nbn:se:miun:diva-30340DOI: 10.1088/1748-0221/12/01/C01068ScopusID: 2-s2.0-85012076972OAI: oai:DiVA.org:miun-30340DiVA: diva2:1077536
18th International Workshop on Radiation Imaging Detectors (IWORID2016)