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Electromagnetic Vibration Energy Harvester with Replaceable Ortho-planar Springs
Mid Sweden University, Faculty of Science, Technology and Media, Department of Computer and Electrical Engineering (2023-).ORCID iD: 0000-0003-3423-2806
Mid Sweden University, Faculty of Science, Technology and Media, Department of Computer and Electrical Engineering (2023-).ORCID iD: 0000-0003-3222-7165
Mid Sweden University, Faculty of Science, Technology and Media, Department of Computer and Electrical Engineering (2023-).ORCID iD: 0000-0001-9572-3639
Mid Sweden University, Faculty of Science, Technology and Media, Department of Computer and Electrical Engineering (2023-).ORCID iD: 0000-0002-8382-0359
2024 (English)In: 2024 IEEE SENSORS, IEEE conference proceedings, 2024Conference paper, Published paper (Refereed)
Abstract [en]

This paper proposes and investigates a novel electro-magnetic vibration energy harvester using ortho-planar springs. Addressing the limited output power of previously reported designs, the proposed harvester targets milliwatt level power outputs to be relevant for practical sensing and IoT applications. The proposed design employs an optimized pickup unit with Halbach array configuration and an optimized ortho-planar spring, which are integrated in a 3D-printed housing. During experimental evaluations, the harvester demonstrates an output power of up to 5.26mW and a normalized power density of 133.05 μW/(cm3∗g2), exceeding the performance of previously reported harvesters with ortho-planar springs. Moreover, exploiting the versatility of ortho-planar spring designs, it is shown that the harvester's frequency response can easily be adjusted to different application conditions. 

Place, publisher, year, edition, pages
IEEE conference proceedings, 2024.
Keywords [en]
electromagnetic transduction, energy harvesting, ortho-planar springs, vibration energy harvester
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:miun:diva-53682DOI: 10.1109/SENSORS60989.2024.10785000Scopus ID: 2-s2.0-85215272025ISBN: 9798350363517 (print)OAI: oai:DiVA.org:miun-53682DiVA, id: diva2:1932189
Conference
Proceedings of IEEE Sensors
Available from: 2025-01-28 Created: 2025-01-28 Last updated: 2025-01-28Bibliographically approved

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Nguyen Phan, TraXu, YeOelmann, BengtBader, Sebastian

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  • apa
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