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Simple method for quality factor estimation in resonating MEMS structures
RISE Acreo AB, Sweden.
RISE Acreo AB, Sweden.
RISE Acreo AB, Sweden.
RISE Acreo AB, Sweden.
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2018 (English)In: Journal of Physics, Conference Series, ISSN 1742-6588, E-ISSN 1742-6596, Vol. 1052, no 1, article id 012100Article in journal (Refereed) Published
Abstract [en]

The quality factor of a packaged MEMS resonating structure depends on both the packaging pressure and the structure’s proximity to the walls. This type of mechanical constraints, which causes energy dissipation from the structure to the surrounding air, are applicable for oscillating energy harvesters and should be considered in the design process. However, the modelling of energy losses or the measurements of their direct influence inside a packaged chip is not trivial. In this paper, a simple experimental method to quantify the energy loss in an oscillating MEMS structures due to the surrounding air is described together with preliminary results. The main advantage of the method is the ability to characterize the damping contributions under different vacuum and packaging conditions without requiring any packaging of the harvester chip or fabrication of multiple devices with different cavity depths.

Place, publisher, year, edition, pages
2018. Vol. 1052, no 1, article id 012100
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:miun:diva-35417DOI: 10.1088/1742-6596/1052/1/012100ISI: 000442553700100Scopus ID: 2-s2.0-85051331110OAI: oai:DiVA.org:miun-35417DiVA, id: diva2:1277022
Available from: 2019-01-09 Created: 2019-01-09 Last updated: 2019-08-06Bibliographically approved

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Rusu, Cristina
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CiteExportLink to record
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Citation style
  • apa
  • ieee
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  • vancouver
  • Other style
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  • de-DE
  • en-GB
  • en-US
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Output format
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