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Evaluation of Thermal Imaging and Simulation Applicable to Testing of Printed Board Assemblies
Mittuniversitetet, Fakulteten för naturvetenskap, teknik och medier, Institutionen för informationsteknologi och medier.
Mittuniversitetet, Fakulteten för naturvetenskap, teknik och medier, Institutionen för informationsteknologi och medier.
2004 (engelsk)Inngår i: THERMINIC 2004 10th international workshop on THERmal INvestigations of ICs and Systems: 29 September - 1 October 2004, Sophia Antipolis, Côte d'Azur, France., Grenoble: Laboratoire TIMA , 2004, s. 119-129Konferansepaper, Publicerat paper (Fagfellevurdert)
Abstract [en]

This paper presents a non-contact method for making relative measurements of the resistance of surface mounted resistors. An application of this technique is in automatic test equipment, i.e. within the limitations of resolution and accuracy of the measuring system it is possible to detect if incorrect resistor values are mounted on a printed board assembly. Measurements are made on two specially designed test boards. Two different measurement systems are used of which one is based on thermopiles and the other is a heat camera equipped with a QWIP (Quantum Well Intersubband Photodetector) detector. The detection of a minimum change of resistance, corresponding to a change of approximately 5 mW in dissipated electrical power, was achieved. Simulations of resistor board systems using; THERMIC 6.6, THERMICPCB 6.6, and Flotherm 3.2; and a dissipation power model are presented as a demonstration of predictions of the thermal fingerprint of a circuit board.

sted, utgiver, år, opplag, sider
Grenoble: Laboratoire TIMA , 2004. s. 119-129
Emneord [en]
Thermopile, QWIP, heat radiation, non-contact measurement, thermal simulation
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Identifikatorer
URN: urn:nbn:se:miun:diva-2922Lokal ID: 2607ISBN: 2-84813-036-9 (tryckt)OAI: oai:DiVA.org:miun-2922DiVA, id: diva2:27954
Tilgjengelig fra: 2008-09-30 Laget: 2008-09-30 Sist oppdatert: 2011-04-28bibliografisk kontrollert

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Persson, UlfHaglund, Daniel

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