miun.sePublications
Change search
Link to record
Permanent link

Direct link
BETA
Unander, Tomas
Publications (10 of 15) Show all publications
Andersson, H., Manuilskiy, A., Gao, J., Lidenmark, C., Sidén, J., Forsberg, S., . . . Nilsson, H.-E. (2014). Investigation of Humidity Sensor Effect in Silver Nanoparticle Ink Sensors Printed on Paper. IEEE Sensors Journal, 14(3), Art. no. 6615915
Open this publication in new window or tab >>Investigation of Humidity Sensor Effect in Silver Nanoparticle Ink Sensors Printed on Paper
Show others...
2014 (English)In: IEEE Sensors Journal, ISSN 1530-437X, E-ISSN 1558-1748, Vol. 14, no 3, p. Art. no. 6615915-Article in journal (Refereed) Published
Abstract [en]

Thin inkjet-printed tracks of silver nanoparticles have previously been observed to show a non-reversible decrease in resistance when exposed to a high degree of relative humidity and thus providing sensor functionality with a memory effect. This paper provides a more in-depth explanation of the observed humidity sensor effect that originates from inkjet-printed silver nanoparticle sensors on a paper substrate. It is shown that the geometry of the sensor has a large effect on the sensor's initial resistance, and therefore also on the sensor's resistive dynamic range. The importance of the sensor geometry is believed to be due to the amount of solvent from the ink interacting with the coating of the paper substrate, which in turn enables the diffusion of salts from the paper coating into the ink and thus affecting the silver ink.

Keywords
Humidity sensor, ink jet, silver nanoparticle ink
National Category
Electrical Engineering, Electronic Engineering, Information Engineering Materials Engineering Nano Technology
Identifiers
urn:nbn:se:miun:diva-19888 (URN)10.1109/JSEN.2013.2284033 (DOI)000331560300002 ()2-s2.0-84892379399 (Scopus ID)STC (Local ID)STC (Archive number)STC (OAI)
Available from: 2013-09-19 Created: 2013-09-19 Last updated: 2017-12-06Bibliographically approved
Andersson, H., Manuilskiy, A., Unander, T., Lidenmark, C., Forsberg, S. & Nilsson, H.-E. (2012). Inkjet printed silver nanoparticle humidity sensor with memory effect on paper. IEEE Sensors Journal, 12(6), 1901-1905
Open this publication in new window or tab >>Inkjet printed silver nanoparticle humidity sensor with memory effect on paper
Show others...
2012 (English)In: IEEE Sensors Journal, ISSN 1530-437X, E-ISSN 1558-1748, Vol. 12, no 6, p. 1901-1905Article in journal (Other academic) Published
Abstract [en]

In this paper, the design and the manufacture of an inkjet printed resistive type humidity sensor on paper are reported. After having been exposed to humidity above a given threshold level, the resistance of the sensor decreases substantially and remains at that level even when thehumidity is reduced. It is possible to deduce the humidity level by monitoring the resistance. The main benefit of the printed sensor presented in this case is in relation to its very low production costs. It has also been shown that both the ink type and this paper combination used prove to be crucial in order to obtain the desired sensor effect. More research is required in order to fully understand the humidity sintering effect on the nano particle ink and the role of the substrate. However, the observed effect can be put to use in printed humidity sensors which possess a memoryfunction. The sensor can be used in various applications for environmental monitoring, for example, in situations where a large number of inexpensive and disposable humidity sensors are required which are able to detect whether they have been subjected to high humidity. This could be the checking of transportation conditions of goods or monitoring humidity within buildings. © 2001-2012 IEEE.

Keywords
Humidity transducers; inkjet printing; nanoparticles; sintering
National Category
Engineering and Technology
Identifiers
urn:nbn:se:miun:diva-14305 (URN)10.1109/JSEN.2011.2182044 (DOI)000303400500016 ()2-s2.0-84860505067 (Scopus ID)STC (Local ID)STC (Archive number)STC (OAI)
Available from: 2011-08-15 Created: 2011-08-15 Last updated: 2017-12-08Bibliographically approved
Nilsson, H.-E., Unander, T., Andersson, H., Manuilskiy, A., Sidén, J. & Gulliksson, M. (2012). System integration of electronic functions in smart packaging applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2(10), 1723-1734
Open this publication in new window or tab >>System integration of electronic functions in smart packaging applications
Show others...
2012 (English)In: IEEE Transactions on Components, Packaging and Manufacturing Technology, ISSN 2156-3950, Vol. 2, no 10, p. 1723-1734Article in journal (Refereed) Published
Abstract [en]

A system integration scheme relevant for smart packaging applications is presented. Recent advances in printed electronics, radio frequency identification tag production, and standardization of communication protocols are factors that increase the design freedom for new applications. As in all new technology fields, the first products are expected to appear in the high-cost segment attracting early adopters in the form of niche products. A reasonable assumption is that these products will come from hybridization of different types of technologies. Such a scenario is likely since no technology solution available can provide all features that these types of applications demand. There is a need of standard solutions for hybridization of silicon devices and printed (or foil-type) components. Conductive ink technology is a powerful tool for hybridization and customization of large-area electronics, providing 3-D integration and large-area customization. However, high-performance communication and advanced processing demand the use of silicon. Smart hybridization solutions allow combination of the best from both worlds. This paper analyzes the requirements on hybridization technologies suitable for smart packaging applications and provides design examples on integration of intrusion surveillance solutions for cellulose-based packaging applications. It shows that even though the current hybridization technologies are far from optimal, they can provide a considerable design freedom and system performance. © 2011-2012 IEEE.

Keywords
Large area sensors; printed electronics; smart packaging
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:miun:diva-14306 (URN)10.1109/TCPMT.2012.2204056 (DOI)000309729400020 ()2-s2.0-84867210457 (Scopus ID)STC (Local ID)STC (Archive number)STC (OAI)
Available from: 2011-08-15 Created: 2011-08-15 Last updated: 2016-10-20Bibliographically approved
Unander, T., Sidén, J. & Nilsson, H.-E. (2011). Designing of RFID based Sensor Solution for Packaging Surveillance Applications. IEEE Sensors Journal, 11(11), 3009-3018
Open this publication in new window or tab >>Designing of RFID based Sensor Solution for Packaging Surveillance Applications
2011 (English)In: IEEE Sensors Journal, ISSN 1530-437X, E-ISSN 1558-1748, Vol. 11, no 11, p. 3009-3018Article in journal (Refereed) Published
Abstract [en]

In this work, a two-chip battery assisted Radio Frequency Identification (RFID) based sensor platform is presented. The radio frequency communication interface is based on the EPC Gen 2 standard. A laboratory setup of the platform has been shown and characterized for a moisture content sensor application. The laboratory setup of the sensor platform has a reading range of 3.4 meters which is in comparison to commercial available Gen 2 tags. The laboratory platform has an average power consumption of 2.1 μW operating at 3 V, which together with a printed battery gives an estimated lifetime for data logging of several years. The proposed RFID platform provides a tradeoff between, communication performance, compatibility with international standards, and flexibility in on-package customization including type and number of sensors. The proposed architecture separates the high-performance communication circuit and the low-frequency sensor interface logic. In the future, the sensor interface maybe integrated using printed logics to further enhance the flexibility and low-ost customization features of the architecture

Keywords
Radio frequency identification (RFID); sensor platform; surveillance application
National Category
Engineering and Technology
Identifiers
urn:nbn:se:miun:diva-12548 (URN)10.1109/JSEN.2011.2155055 (DOI)000304164900016 ()2-s2.0-80055054917 (Scopus ID)STC (Local ID)STC (Archive number)STC (OAI)
Available from: 2010-12-13 Created: 2010-12-13 Last updated: 2017-12-11Bibliographically approved
Sidén, J., Gao, J., Unander, T., Andersson, H., Jonsson, P., Nilsson, H.-E. & Gulliksson, M. (2011). Electric and Electromagnetic Coupled Sensor Components for Passive RFID. In: 2011 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2011: . Paper presented at 2011 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2011;Tel Aviv;7 November 2011through9 November 2011;Code88060 (pp. 1-5). IEEE conference proceedings
Open this publication in new window or tab >>Electric and Electromagnetic Coupled Sensor Components for Passive RFID
Show others...
2011 (English)In: 2011 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2011, IEEE conference proceedings, 2011, p. 1-5Conference paper, Published paper (Refereed)
Abstract [en]

This work discuss the possibilities of integrating passive sensor components to passive UHF RFID tags. The sensor system works by degrading a tag's communication performance in proportion to a sensed quantity. Two approaches are studied, sensors directly integrated to tag antenna structures and sensors electromagnetically coupled to tag antennas. The em coupled sensors provide the possibility to produce small sensor components as easily applied add-ons to ordinary commercial RFID tags.

Place, publisher, year, edition, pages
IEEE conference proceedings, 2011
Keywords
RFID, Sensors
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:miun:diva-15456 (URN)10.1109/COMCAS.2011.6105932 (DOI)2-s2.0-84855767354 (Scopus ID)STC (Local ID)978-1-4577-1692-8 (ISBN)STC (Archive number)STC (OAI)
Conference
2011 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2011;Tel Aviv;7 November 2011through9 November 2011;Code88060
Available from: 2011-12-19 Created: 2011-12-19 Last updated: 2016-10-19Bibliographically approved
Unander, T. & Nilsson, H.-E. (2011). Evaluation of RFID based sensor platform for packaging surveillance applications. In: 2011 IEEE International Conference on RFID-Technologies and Applications, RFID-TA 2011: . Paper presented at 2011 2nd IEEE RFID Technologies and Applications Conference, RFID-TA 2011, Collocated with the 2011 IEEE MTT-S International Microwave Workshop Series on Millimeter Wave Integration Technologies, IMWS 2011; Sitges; 15 September 2011 through 16 September 2011 (pp. 27-31). IEEE conference proceedings
Open this publication in new window or tab >>Evaluation of RFID based sensor platform for packaging surveillance applications
2011 (English)In: 2011 IEEE International Conference on RFID-Technologies and Applications, RFID-TA 2011, IEEE conference proceedings, 2011, p. 27-31Conference paper, Published paper (Refereed)
Abstract [en]

In this work a two-chip Battery-Assisted Passive (BAP) Radio Frequency Identification (RFID) based sensor platform is evaluated for two different packaging surveillance applications. The results show that the sensor platform easily can be tailored to be used with different types of sensors to achieve the wanted solution, such as, shock, tilt and tamper evidence sensors and detectors. For the tilt sensor solution the sensor platform have a battery lifetime up to 3.3 years when being powered by a battery with an energy capacity of 33 mAh.

Place, publisher, year, edition, pages
IEEE conference proceedings, 2011
Keywords
RFID; Sensor platform; Surveillance application
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:miun:diva-13338 (URN)10.1109/RFID-TA.2011.6068611 (DOI)2-s2.0-82155192676 (Scopus ID)STC (Local ID)978-145770027-9 (ISBN)STC (Archive number)STC (OAI)
Conference
2011 2nd IEEE RFID Technologies and Applications Conference, RFID-TA 2011, Collocated with the 2011 IEEE MTT-S International Microwave Workshop Series on Millimeter Wave Integration Technologies, IMWS 2011; Sitges; 15 September 2011 through 16 September 2011
Available from: 2011-03-02 Created: 2011-03-02 Last updated: 2016-10-19Bibliographically approved
Li, J., Unander, T., Cabezas, A. L., Shao, B., Liu, Z., Feng, Y., . . . Zhang, S.-L. (2011). Ink-Jet Printed Thin-Film Transistors with Carbon Nanotube Channels Shaped in Long Strips. Journal of Applied Physics, 109(8), Art. no. 084915
Open this publication in new window or tab >>Ink-Jet Printed Thin-Film Transistors with Carbon Nanotube Channels Shaped in Long Strips
Show others...
2011 (English)In: Journal of Applied Physics, ISSN 0021-8979, E-ISSN 1089-7550, Vol. 109, no 8, p. Art. no. 084915-Article in journal (Refereed) Published
Abstract [en]

The present work reports on the development of a class of sophisticated thin-film transistors (TFTs) based on ink-jet printing of pristine single-walled carbon nanotubes (SWCNTs) for the channel formation. The transistors are manufactured on oxidized silicon wafers and flexible plastic substrates at ambient conditions. For this purpose, ink-jet printing techniques are developed with the aim of high-throughput production of SWCNT thin-film channels shaped in long strips. Stable SWCNT inks with proper fluidic characteristics are formulated by polymer addition. The present work unveils, through Monte Carlo simulations and in light of heterogeneous percolation, the underlying physics of the superiority of long-strip channels for SWCNT TFTs. It further predicts the compatibility of such a channel structure with ink-jet printing, taking into account the minimum dimensions achievable by commercially available printers. The printed devices exhibit improved electrical performance and scalability as compared to previously reported ink-jet printed SWCNT TFTs. The present work demonstrates that ink-jet printed SWCNT TFTs of long-strip channels are promising building blocks for flexible electronics. (C) 2011 American Institute of Physics. [doi:10.1063/1.3569842]

Keywords
ALIGNED ARRAYS; RANDOM NETWORKS; TRANSPORT; CIRCUITS; SCALE
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:miun:diva-12549 (URN)10.1063/1.3569842 (DOI)000290047000242 ()2-s2.0-79955723280 (Scopus ID)STC (Local ID)STC (Archive number)STC (OAI)
Available from: 2010-12-13 Created: 2010-12-13 Last updated: 2017-12-11Bibliographically approved
Nilsson, H.-E., Andersson, H., Manuilskiy, A., Unander, T., Hammarling, K., Sidén, J. & Gulliksson, M. (2011). Printed write once and read many sensor memories in smart packaging applications. IEEE Sensors Journal, 11(9), 1759-1767
Open this publication in new window or tab >>Printed write once and read many sensor memories in smart packaging applications
Show others...
2011 (English)In: IEEE Sensors Journal, ISSN 1530-437X, E-ISSN 1558-1748, Vol. 11, no 9, p. 1759-1767Article in journal (Refereed) Published
Abstract [en]

A horizontal printed Write Once Read Many (WORM) resistive memory has been developed for use in wireless sensortags targeting single event detection in smart packaging applications. The WORM memory can be programmed using a 1.5 V printedbattery. An alternative programming method is to use chemical sintering which allows the development of exposure-time triggeredsingle event tags that can be accessed wirelessly. The new WORM memory has very low losses in the ON-state which allows directintegration into antenna structures.A sensor tag that utilizes the WORM memory functionality and the well established Electronic Article Surveillance (EAS)communication standard has been outlined. Both active and fully passive sensor tag solutions have been proposed.The role of printed electronics in smart packaging applications has been reviewed and discussed. Important enabling factors forthe future development have been highlighted, such as the need for hierarchical design and test tools, better printed interconnecttechnologies as well as better components that allow communication with existing information and communication technology (ICT)standards. This is illustrated and underlined by the presented smart packaging concept demonstrators.

Keywords
Flexible structures, printed sensors, telemetry, Grippers, Packaging, Programming, Resistance, Silver, Substrates, Switches
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:miun:diva-13339 (URN)10.1109/JSEN.2010.2095496 (DOI)000293710700002 ()2-s2.0-79960982087 (Scopus ID)STC (Local ID)STC (Archive number)STC (OAI)
Available from: 2011-03-02 Created: 2011-03-02 Last updated: 2017-12-11Bibliographically approved
Unander, T. (2011). System integration of electronic functionality in packaging application. (Doctoral dissertation). Sundsvall: Mid Sweden University
Open this publication in new window or tab >>System integration of electronic functionality in packaging application
2011 (English)Doctoral thesis, comprehensive summary (Other academic)
Abstract [en]

Sensor applications are becoming increasingly important as products are now being requested to be more and more intelligent and safe. As the costs involved in sensor technology decrease its usage will spread to new market segments including new areas with products that have never previously used such functionalities, including, wood fibre based products for packaging, hygiene or graphical use. Currently there is a significant interest in developing technology that will allow packages to become interactive and be integrated with digital services accessible on the Internet. In this thesis, the system integration of a hybrid RFID based sensor platform is presented. This proposed platform provides a trade-off between the communication performance and its compatibility with international standards and also includes flexibility in on‐package customization, including the type and number of sensors. In addition it combines the use of traditional silicon based electronics with printed electronics directly onto wood fibre based materials so as to enable the possibility of creating smart packages. Together with the system integration of the sensor platform, five printed moisture sensor concepts that are designed to work with the sensor platform are presented and characterized. Firstly, there is a moisture sensor that shows a good correlation to the moisture content of wood fibre based substrates. The second one involves a sensor that detects high relative humidity levels in the air and the third is an action activated energy cell that provides power when activated by moisture. The fourth one deals with two types of moisture sensors that utilize silver nano-particles in order to measure the relative humidity in the air. The final one is a printable touch sensitive sensor that is sensitive to the moisture contained in the hand. A concept of remote moisture sensing that utilizes ordinary low cost RFID tags has also been presented and characterized.

The main focus is thus on system integration to, by combining silicon based electronics with printed electronics, find the most low cost solution with regards to flexibility, sensor functions and still meet the communication standards.

Abstract [sv]

När efterfrågan på mer intelligenta och säkra produkter ökar så ökar även intresset för olika typer av sensorer. När kostnaden för dessa sensorer sjunker så kommer användandet av dessa att utökas till nya marknadssegment som tidigare inte använt denna typ av funktionalitet, som tillexempel pappersbaserade förpackningar, hygienartiklar och papper för grafiskttryck. Det är för närvarande ett stort intresse att utveckla tekniker som tillåter förpackningar att bli interaktiva och integrerade med olika digitala tjänster kopplade till Internet. I denna avhandling så presenteras systemintegrationen av en RFID baserad sensor plattform som tillhandahåller en avvägning mellan kommunikationsprestanda, kompabilitet med internationella standarder och kundanpassningsflexibilitet. Där man direkt på förpackningen kombinerar fördelarna med traditionell kiselbaserad elektronik med trycktelektronik för att kunna skapa intelligenta förpackningar. I avhandlingen presenteras och utvärderas även fem trycka fuktsensorer som är designade att kunna användas tillsammans med sensor plattformen. Den första sensorn mäter fukthalten i cellulosabaserade substrat. Den andra kan detektera höga fukthalter i luften. Den tredje, som aktiveras vid en händelse, producerar en elektrisk ström när den blir fuktig. Den fjärde sensorn använder sig av silverbaserade partiklar i nanostorlek för att mäta fukthalten i luften. Den femte sensorn är en beröringskänslig sensor som ger utslag av fukten i handen. Utöver dessa sensorer så utvärderas även ett koncept med en fuktsensor som kan läsas av på avstånd.

Fokus är således att på system integrationsnivå, med hjälp av att kombinera kisel elektronik med tryckt elektronik, hitta den mest kostnadseffektiva lösningen med avseende på flexibilitet, sensor funktionalitet och att även kunna möta kommunikationsstandarderna.

Place, publisher, year, edition, pages
Sundsvall: Mid Sweden University, 2011. p. 97
Series
Mid Sweden University doctoral thesis, ISSN 1652-893X ; 112
Keywords
sensor platform, RFID, printed electronics, moisture sensors
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:miun:diva-14311 (URN)STC (Local ID)978‐91‐86694‐49‐4 (ISBN)STC (Archive number)STC (OAI)
Public defence
2011-09-23, O102, Holmgatan 10, Sundsvall, 13:00 (English)
Opponent
Supervisors
Available from: 2011-08-16 Created: 2011-08-15 Last updated: 2016-10-19Bibliographically approved
Unander, T. & Nilsson, H.-E. (2009). Characterization of Printed Moisture Sensors in Packaging Surveillance Applications. IEEE Sensors Journal, 9(8), 922-928
Open this publication in new window or tab >>Characterization of Printed Moisture Sensors in Packaging Surveillance Applications
2009 (English)In: IEEE Sensors Journal, ISSN 1530-437X, E-ISSN 1558-1748, Vol. 9, no 8, p. 922-928Article in journal (Refereed) Published
Abstract [en]

This work presents a study on the performance of printed low cost moisture sensors fabricated using conductive ink on paper substrates. The sensors are intended to add value to the surveillance of packages. Two different kinds of sensors are evaluated and characterized. The two sensors have similar geometrical shapes, but different measuring principles are employed. The first sensor is measuring the moisture content in cellulose based substrates, while the second is measuring high levels of relative humidity in the surroundings. The sensors have been developed so that they can be integrated into Radio Frequency Identification (RFID) systems for surveillance in logistic chains. A laboratory setup of a RFID tag with sensor capability based on an ordinary passive RFID tag has been shown.

Keywords
Moisture content sensor, relative humidity sensor, printed sensors
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:miun:diva-7048 (URN)10.1109/JSEN.2009.2024866 (DOI)000268020400008 ()2-s2.0-67749088246 (Scopus ID)5033 (Local ID)5033 (Archive number)5033 (OAI)
Available from: 2008-11-13 Created: 2008-11-13 Last updated: 2017-12-14Bibliographically approved
Organisations

Search in DiVA

Show all publications